PACKAGE FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND SENSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To solve the problem of a conventional package for electronic component that an angle to a mounting surface of a mounting substrate is indefinite in a state of mounting on the mounting substrate.

SOLUTION: A package P for sensor is characterized in that an end surface of a substrate-like package body 10 having a sensing element 38 as an electronic component mounted is mounted abutting on a flat mounting surface 14a of the mounting substrate 14. The end surface 10c of the package body 10 abutting on the mounting surface 14a is formed in a flat cut surface, a first notch part 32a is formed at a boundary between the cut surface and a first side surface intersecting with the cut surface, and a pad 44 electrically connected to the sensing element 38 is formed on an inner wall surface of the first notch part 32a.

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