发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND THE SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To form an LDD (Lightly Doped Drain) diffusion layer for a highly pressure-resistive transistor for forming a source/drain region of an offset structure without the need for additional steps. Ž<P>SOLUTION: An electrode forming film 41 having a first insulating film 42 on its upper surface is formed on a semiconductor substrate 11 via a gate insulating film 21. A first gate electrode 22 and a plurality of dummy patterns 51 disposed along both sides of the first gate electrode apart from each other are formed by the electrode forming film 41. The first LDD diffusion layers 23, 24 are formed in the semiconductor substrate 11 by ion implantation using the first gate electrode 22 and the dummy patterns 51 as masks. First sidewalls 25 are formed on a sidewall of the first gate electrode 22, on sidewalls of the dummy patterns 51, between the first gate electrode 22 and each dummy pattern 51 and between the respective dummy patterns 51. First source/drain regions 26, 27 are formed on the semiconductor substrate 11 using the first gate electrode 22, each dummy pattern 51 and each first sidewall 25 as masks. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010171115(A) 申请公布日期 2010.08.05
申请号 JP20090010788 申请日期 2009.01.21
申请人 SONY CORP 发明人 OKUBO KENICHI
分类号 H01L21/8234;H01L21/8238;H01L27/088;H01L27/092 主分类号 H01L21/8234
代理机构 代理人
主权项
地址
您可能感兴趣的专利