发明名称 Manufacturing method of a semiconductor device, and substrate processing apparatus
摘要 An object of this invention is to make it possible to suppress early-stage oxidation of a substrate surface prior to oxidation processing, and to remove a natural oxidation film. For this reason, a method is provided comprising the steps of loading a substrate into a processing chamber, supplying a hydrogen-containing gas and an oxygen-containing gas into the processing chamber, and subjecting a surface of the substrate to oxidation processing, and unloading the substrate subjected to oxidation processing from the processing chamber. In the oxidation processing step, the hydrogen-containing gas is introduced in advance into the processing chamber, with the pressure inside the processing chamber set at a pressure that is less than atmospheric pressure, and the oxygen-containing gas is then introduced in the state in which the introduction of the hydrogen-containing gas is continued.
申请公布号 US2010192855(A1) 申请公布日期 2010.08.05
申请号 US20100656566 申请日期 2010.02.03
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 YUASA KAZUHIRO;MEGAWA YASUHIRO
分类号 B05C11/00 主分类号 B05C11/00
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