发明名称 GROUND RETURN FOR PLASMA PROCESSES
摘要 A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.
申请公布号 US2010196626(A1) 申请公布日期 2010.08.05
申请号 US20100700484 申请日期 2010.02.04
申请人 APPLIED MATERIALS, INC. 发明人 CHOI SOO YOUNG;TINER ROBIN L.;KURITA SHINICHI;WHITE JOHN M.;SORENSEN CARL A.;KHO JEFFREY A.;ANWAR SUHAIL;INAGAWA MAKOTO;FURUTA GAKU
分类号 C23C16/509 主分类号 C23C16/509
代理机构 代理人
主权项
地址