| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting structure for a semiconductor apparatus capable of certainly insulating a semiconductor apparatus 10 from a heat radiator 30. <P>SOLUTION: A mounting structure for a semiconductor apparatus for mounting a semiconductor apparatus 10 on a heat radiator 30 while the back side of a heat sink 11 is opposed to an insulating layer 20 side. A groove 31 having a predetermined depth is formed on a surface of the heat radiator 30 on which the semiconductor apparatus 10 is mounted, at a position opposed to a side of the heat sink 11 exposed from a molding resin 13. By such a mounting structure for the semiconductor apparatus, the semiconductor apparatus 10 in which a protrusion is formed on the side of the heat sink 11 exposed from the molding resin 13 and the protrusion is protruded to the backside of the heat sink 11, is mounted on the heat radiator 30. Even when the protrusion penetrates the insulating sheet 20, the protrusion is housed in the groove 31 formed in the heat radiator 30 to prevent the heat sink 11 and the heat radiator 30 from contacting with each other, and thereby, insulation between the semiconductor apparatus 10 and the heat radiator 30 is ensured. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
