| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicon microphone improved in high-pass characteristics by devising the arrangement of sound holes to be formed in a microphone package. SOLUTION: An MEMS chip 14 and an LSI chip 16 are housed in an internal space 13 of the microphone package 12. A plurality of sound holes 24 are formed in a cover 22 of the microphone package 12. The respective sound holes 24 are formed over all circumferences, excluding a position right over the MEMS chip 14 and surrounding the position right over the MEMS chip 14. Alternatively, a plurality of sound holes of the respective sound holes 24 each are formed along a position adjacent to two sides at both sides of the internal space 13 in a longitudinal direction of the microphone package 12. Alternatively, a plurality of sound holes 38 are formed side by side on a sidewall 12 of the microphone package 12. COPYRIGHT: (C)2010,JPO&INPIT
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