| 摘要 |
PROBLEM TO BE SOLVED: To provide a benzoxazole resin precursor which gives a polybenzoxazole resin having excellent heat resistance, and to provide a polybenzoxazole resin having heat resistance and a low dielectric constant, a resin film and a semiconductor device using the resin film. SOLUTION: The benzoxazole resin precursor includes a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has a diamondoid structure. There is also provided the benzoxazole resin precursor further including a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure. The polybenzoxazole resin is obtained by the ring-closing reaction with dehydration of the benzoxazole resin precursor. The resin film includes the benzoxazole resin precursor or the polybenzoxazole resin. COPYRIGHT: (C)2010,JPO&INPIT
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