发明名称 Kühlvorrichtung
摘要 A heat dissipation device is that at least one rigidly heat-conducting material is disposed to a base of a heat dissipation fin set and extended among heat dissipation fins. At least one flexible superconductor passes through the heat dissipation fins. One end of the flexible superconductor is welded with the rigidly heat-conducting material. A fluid is filled within a flexible tube body of the flexible superconductor and can play a role of rapidly transporting mass of heat in a condition of unchanged temperature to improve the heat conduction efficiency of the heat dissipation fins.
申请公布号 DE202010006224(U1) 申请公布日期 2010.08.05
申请号 DE20102006224U 申请日期 2010.04.29
申请人 TAIWAN OASIS TECHNOLOGY CO. LTD. 发明人
分类号 F21V29/00 主分类号 F21V29/00
代理机构 代理人
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