发明名称 CUTTER AND METHOD FOR CUTTING BRITTLE MATERIAL SUBSTRATE USING SAME
摘要 <p>Provided is a cutter which can reliably form a diagonal crack further in the direction of the thickness of a brittle material substrate. The cutter has a shape wherein the congruent bottom surfaces of the two circular cones or two circular truncated cones sharing a rotating axis (22) are bonded and the circumferential portion of the bottom surfaces is formed as a blade edge ridge line (21). On the blade edge ridge line (21), grooves (23) tilted by a predetermined angle with respect to the rotating axis direction are formed at predetermined intervals in the circumferential direction. Furthermore, angles (blade angle (?1), blade angle (?2)) formed by the side surfaces of the two circular cones or those of the circular truncated cones and the bottom surfaces are different from each other.</p>
申请公布号 WO2010087423(A1) 申请公布日期 2010.08.05
申请号 WO2010JP51184 申请日期 2010.01.29
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.;TOMINAGA, KEISUKE;MAEKAWA, KAZUYA 发明人 TOMINAGA, KEISUKE;MAEKAWA, KAZUYA
分类号 C03B33/10;B28D1/24;B28D5/04;C03B33/04 主分类号 C03B33/10
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