| 摘要 |
<p>A board is affixed to a predetermined position and can be carried to a soldering processing portion. An automatic soldering device is provided with a carrier pawl (10) for holding a printed board (W1), carrier chains (15a, 15b) for driving the carrier pawl (10) from a heater portion (4) to a solder bath (5), a first frame (9A) for guiding the carrier chains (15a, 15b) along the heater portion (4), a second frame (9B) for guiding the carrier chains (15a, 15b) along the solder bath (5), and an absorbing member (124) which is provided between the frame (9A) and the frame (9B) so as to absorb the expansion and contraction caused by the difference of the thermal expansion between the frames (9A, 9B) and the carrier chains (15a, 15b). The absorbing member (124) absorbs the expansion and contraction caused by the difference of the thermal expansion between the frames (9A, 9B) and the carrier chains (15a, 15b), thus making it possible to prevent the carrier chains (15a, 15b) from being shifted from the frames (9A, 9B). As a result, the printed board (W1) is affixed to the predetermined position and can be carried to the heater portion (4) and the solder bath (5).</p> |
