发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of improving processing accuracy with an inexpensive structure of the apparatus. <P>SOLUTION: The substrate processing apparatus is equipped with a processing head 73 by which prescribed processing is performed on an arbitrary part on the surface of a substrate K and driving means 74X, 74Y by which the substrate K and the processing head 73 are relatively moved. A one-dimensional or two-dimensional prescribed processing is performed on the substrate K by relatively moving the substrate K and the processing head 73. The apparatus is configured to have a storage means 92 in which control data D6X, D6Y are stored for the purpose of providing the driving means 74X, 74Y with apparent true straightness, and to correctively drive the driving means 74X, 74Y based on the control data D6X, D6Y in accordance with the relative movement of the substrate K and the processing head 73. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010167458(A) 申请公布日期 2010.08.05
申请号 JP20090012494 申请日期 2009.01.23
申请人 TORAY ENG CO LTD 发明人 TAO MASANORI;UCHIGATA TOMOO;HAMAKAWA NAOYOSHI;WADA HIROMITSU
分类号 B23K26/00;B23K26/08;B23K101/36;H01L21/302;H01L31/04 主分类号 B23K26/00
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