| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a deposition apparatus capable of film deposition in a uniform film thickness without increasing power to be inputted to a plasma gun with time in during its continuous operation. Ž<P>SOLUTION: The deposition apparatus includes a vacuum chamber 3, a plasma gun 9 adapted to emit a plasma onto a deposition material 22 accommodated in the vacuum chamber, and a discharge gas supply unit adapted to supply a discharge gas to the plasma gun. The deposition apparatus comprises a mass flow controller 25 adapted to change flow rate of the discharge gas, and a control circuit 26 which is connected to the mass flow controller and adapted to control, the change in flow rate by the mass flow controller, based on a predetermined setting. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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