发明名称 LOW IMPEDANCE-LOSS LINE STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To improve the signal integrity and the EMC by applying the low impedance-loss line structure having a very low terminal impedance and a very low transmission coefficient S<SB>21</SB>in the band from several MHz to about 10 GHz to the power supply distribution circuit of a switching mode electrical circuit. Ž<P>SOLUTION: The low impedance-loss line structure has a coaxial line structure chip which is formed of a silver paste layer 11, a carbon graphite layer 12, a conductive polymer layer 14 impregnated in a chemical etching layer, and an aluminum wire 13. The coaxial line structure chip is connected conductively with the leadframe and molded of coating resin, and then the negative electrode terminal and the positive electrode terminal of the leadframe are shaped, respectively, into the shape of the ground terminal and the shape of the power terminal thus forming a low impedance-loss line component. A microstrip line structure chip may be used in place of the coaxial line structure chip. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010171601(A) 申请公布日期 2010.08.05
申请号 JP20090011005 申请日期 2009.01.21
申请人 I CAST:KK 发明人 TOYA HIROKAZU;TOOYA NORIHISA
分类号 H01P1/22;H01G9/028;H01G9/04 主分类号 H01P1/22
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