| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve problems wherein thermosetting resin is used for a resin component that undergoes a reflow soldering process because it is thermally deformed if thermoplastic resin is used, but thermosetting resin used as an optical component is not only expensive but also often in a liquid form of high fluidity, and a gas release hole is conventionally provided to release air in a mold and molding pressure is applied to improve mold copying of a molded article when molded, but the viscosity of the thermosetting resin is fairly low, so that the resin gets into the gas release hole to impede molding. Ž<P>SOLUTION: An appropriate amount of liquid resin 33 is poured into a preheated mold using a dispenser, and pressure is applied to the liquid resin 33 with gas 37. The appropriate amount is an amount slightly greater than the amount to completely fill up a gate part provided at the top of a cavity. After the dispenser is retreated, a gas supply member 34 is pressed against the top of a runner to produce an airtight seal with the runner, and then the gas pressure is increased to a desired pressure. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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