发明名称 |
METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD |
摘要 |
In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided. |
申请公布号 |
WO2010085830(A1) |
申请公布日期 |
2010.08.05 |
申请号 |
WO2010AT00024 |
申请日期 |
2010.01.22 |
申请人 |
DCC - DEVELOPMENT CIRCUITS & COMPONENTS GMBH;WEICHSLBERGER, GUENTHER;STAHR, JOHANNES;LEITGEB, MARKUS;ZLUC, ANDREAS;WEIDINGER, GERALD |
发明人 |
WEICHSLBERGER, GUENTHER;STAHR, JOHANNES;LEITGEB, MARKUS;ZLUC, ANDREAS;WEIDINGER, GERALD |
分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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