SOLDER MATERIAL, PROCESS FOR PRODUCING THE SOLDER MATERIAL, JOINT PRODUCT, PROCESS FOR PRODUCING THE JOINT PRODUCT, POWER SEMICONDUCTOR MODULE, AND PROCESS FOR PRODUCING THE POWER SEMICONDUCTOR MODULE

摘要

A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.