发明名称 |
Thermally enhanced semiconductor package |
摘要 |
Disclosed are systems and methods for improving the thermal performance of integrated circuit packages. Aspects of the present invention include improved thermal package structures and methods for producing the same through the application of one or more thermal spreaders in the package. In embodiments, a thermal spreader is incorporated in a semiconductor chip package between a semiconductor die and its die pad. By including a thermal spreader in an IC package, the package can handle higher levels of power while maintaining approximately the same temperature of the package or can reduce the temperature of the package when operating at the same power level, as compared to a package without a thermal spreader. |
申请公布号 |
EP2214203(A2) |
申请公布日期 |
2010.08.04 |
申请号 |
EP20100000333 |
申请日期 |
2010.01.15 |
申请人 |
MAXIM INTEGRATED PRODUCTS INC. |
发明人 |
RAILKAR, TARAK A.;CATE, STEVEN D. |
分类号 |
H01L23/433 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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