| 发明名称 |
WIRELESS CHIP |
| 摘要 |
<p>The invention comprises a wireless chip comprising: a substrate; an integrated circuit formed on the substrate; a first interlayer insulating film over the integrated circuit; a wiring over the first interlayer insulating film; a second interlayer insulating film over the wiring; and an antenna over the second interlayer insulating film, the antenna overlapping the integrated circuit and the wiring.</p> |
| 申请公布号 |
EP1803154(B1) |
申请公布日期 |
2010.08.04 |
| 申请号 |
EP20050782152 |
申请日期 |
2005.09.02 |
| 申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
SHIONOIRI, YUTAKA |
| 分类号 |
H01L21/822;G06K19/07;G06K19/077;H01L21/3205;H01L23/52;H01L27/04;H04B1/59;H04B5/02 |
主分类号 |
H01L21/822 |
| 代理机构 |
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