| 摘要 |
<p>A chip mounter has a manipulator and a bed (16). The manipulator picks up an electronic component (12) from an electronic component feeding device (14), transfers the electronic component to the electronic component mounted surface of a printed board (18), and mounts the electronic component on the electronic component mounted surface. The bed is located above the manipulator or sidewise relative to the manipulator for mounting the printed board vertically or downwardly.
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