发明名称 METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR WAFER SURFACES USING A PLURALITY OF INLETS AND OUTLETS HELD IN CLOSE PROXIMITY TO THE WAFER SURFACE
摘要 <p>One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.</p>
申请公布号 KR20100087399(A) 申请公布日期 2010.08.04
申请号 KR20107013940 申请日期 2003.09.30
申请人 LAM RESEARCH CORPORATION 发明人 DE LARIOS JOHN M.;GARCIA JAMES P.;WOODS CARL;RAVKIN MIKE;REDEKER FRITZ;BOYD JOHN;NICKHOU AFSHIN
分类号 H01L21/304;C25D5/22;C25D7/12;H01L21/00;H01L21/02 主分类号 H01L21/304
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