发明名称 |
Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same |
摘要 |
Disclosed herein are a semiconductor package substrate and a method for fabricating the same. In the semiconductor package substrate, the circuit layer of the wire bonding pad side differs in thickness from that of the ball pad side to which a half etching process is applied. In addition, a connection through hole is constructed to provide an electrical connection between the plating lead lines on the wire bonding pad side and the ball pad side, thereby preventing electrical disconnection when the plating lead line of the wire bonding pad side is cut. |
申请公布号 |
US7768116(B2) |
申请公布日期 |
2010.08.03 |
申请号 |
US20060495649 |
申请日期 |
2006.07.31 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YOON KYOUNG RO;SHIN YOUNG HWAN;KIM YOON SU;LEE TAE GON |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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