发明名称 Devices using abrupt metal-insulator transition layer and method of fabricating the device
摘要 The abrupt metal-insulator transition device includes: an abrupt metal insulator transition material layer including an energy gap of less than or equal to 2 eV and holes within a hole level; and two electrodes contacting the abrupt metal-insulator transition material layer. Here, each of the two electrodes is formed by thermally treating a stack layer of a first layer formed on the abrupt metal-insulator transition material layer and comprising Ni or Cr, a second layer formed on the first layer and comprising In, a third layer formed on the second layer and comprising Mo or W, and a fourth layer formed on the third layer and comprising Au.
申请公布号 US7767501(B2) 申请公布日期 2010.08.03
申请号 US20050721069 申请日期 2005.12.05
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 YOUN DOO-HYEB;KIM HYUN-TAK;CHAE BYUNG-GYU;MAENG SUNG-LYUL;KANG KWANG-YONG
分类号 H01L21/335 主分类号 H01L21/335
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