EXPOSURE METHOD, EXPOSURE APPARATUS, AND METHOD OF MANUFACTURING A DEVICE

摘要

An exposure method for preventing accumulation of process error for substrates processed by an apparatus designed for multiprocessing and producing high quality semiconductor chips. A semiconductor integrated circuit production line polishes wafers of individual lots at a first processing system and second processing system of a CMP system two at a time. Wafer processing information indicating at which processing system of the first processing system and second processing system each wafer has been processed is transmitted through a communication line to a later processing apparatus including an exposure apparatus. The wafers of a lot loaded in the exposure apparatus are allocated to a plurality of processing systems of the exposure apparatus so that wafers processed by the same processing system are processed by the same processing system among the two processing systems of the exposure apparatus and are exposed at those processing systems.