发明名称 MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR AND FLEXIBLE SEMICONDUCTOR
摘要 <p>A layered film of a three-layer clad foil formed with a first metal layer 23, a second metal layer 25, and an inorganic insulating layer 35 interposed therebetween is prepared. After the second metal layer 25 is partially etched to form a gate electrode 20g, the first metal layer 23 is partially etched to form source/drain electrodes 20s, 20d in a region corresponding to the gate electrode 20g. A semiconductor layer 40 is then formed in contact with the source/drain electrodes 20s, 20d and on the gate electrode 20g with the inorganic insulating layer 35 interposed therebetween. The inorganic insulating layer 35 on the gate electrode 20g functions as a gate insulating film 30, and the semiconductor layer 40 between the source/drain electrodes 20s, 20d on the inorganic insulating layer 35 functions as a channel.</p>
申请公布号 KR20100086930(A) 申请公布日期 2010.08.02
申请号 KR20097014205 申请日期 2008.10.01
申请人 PANASONIC CORPORATION 发明人 HIRANO KOICHI;NAKATANI SEIICHI;KOMATSU SHINGO;YAMASHITA YOSHIHISA;ICHIRYU TAKASHI
分类号 H01L29/786;G02F1/136 主分类号 H01L29/786
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