发明名称 CAMERA MODULE PACKAGE
摘要 PURPOSE: A camera module package is provided to form a receiving space to mount a passive element on a rigid substrate, thereby removing a need of a separate receiving space in a flexible substrate. CONSTITUTION: A rigid substrate(120) mounts an image sensor installed in a camera body(110). The rigid substrate forms a receiving space. A passive device of a flexible substrate(130) is mounted at a location corresponding to the receiving space of the rigid substrate. The rigid substrate comprises a penetration hole providing the receiving space. The rigid substrate comprises a receiving groove providing the receiving space. The receiving space is formed by a shape corresponding to the passive device.
申请公布号 KR20100086235(A) 申请公布日期 2010.07.30
申请号 KR20090005497 申请日期 2009.01.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, YONG GU;LEE, KOOK HYUNG
分类号 H04N5/225;G03B17/00;H01L27/146 主分类号 H04N5/225
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