发明名称 |
CAMERA MODULE PACKAGE |
摘要 |
PURPOSE: A camera module package is provided to form a receiving space to mount a passive element on a rigid substrate, thereby removing a need of a separate receiving space in a flexible substrate. CONSTITUTION: A rigid substrate(120) mounts an image sensor installed in a camera body(110). The rigid substrate forms a receiving space. A passive device of a flexible substrate(130) is mounted at a location corresponding to the receiving space of the rigid substrate. The rigid substrate comprises a penetration hole providing the receiving space. The rigid substrate comprises a receiving groove providing the receiving space. The receiving space is formed by a shape corresponding to the passive device.
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申请公布号 |
KR20100086235(A) |
申请公布日期 |
2010.07.30 |
申请号 |
KR20090005497 |
申请日期 |
2009.01.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, YONG GU;LEE, KOOK HYUNG |
分类号 |
H04N5/225;G03B17/00;H01L27/146 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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