| 摘要 |
An electroless Sn reduction plating solution for metal products and an electroless plating method using the same are provided to secure the reliability of plated metal products and improve the quality thereof. An electroless Sn reduction plating solution for metal products comprises tin ions and a reducing agent. The metal represents copper. The reducing agent is a compound including disulfide groups. The reducing agent indicates the compound having a symmetrical structure. The reducing agent is represented by the formula 1 of R1-S-S-R2, wherein the R1 and R2 are C1-C6 alkyl groups. The reducing agent indicates bis-(3-sodium sulfopropyl disulfide). The electroless Sn reduction plating solution additionally contains a complexing agent or an antioxidant. |
