MANUFACTURING METHOD FOR ELECTRONIC EQUIPMENT USING HOT MELT TAPE AND BONDING APPARATUS FOR THE SAME

摘要

PURPOSE: An adhesion method of an electronic device using a hot melt tape is provided to obtain enough coherence due to a low thermal conductivity and a narrow flange of an injection frame in which a window is mounted and to improve productivity and workability. CONSTITUTION: A hot melt tape(T) includes a first adhesive layer contacting with a first part, aluminum foil(T3) contacting with the first adhesive layer(T1), a second adhesive layer(T2) contacting with the aluminum foil and a second part, and a release paper(T4) which is attached to the second adhesive layer. A hollow is included on the first adhesive layer, the aluminum foil, and the second adhesive layer of the hot melt layer. An adhesion method of an electronic device using the holt melt tape comprises: a first adhesion step of combining the fist adhesive layer with the first part by sanctioning high frequency; a step of eliminating the release paper which is attached to the second adhesive layer; and a second adhesion step of combining the second adhesive layer with the second part.