SOLDERING DEVICE AND METHOD OF SOLDERING

摘要

PROBLEM TO BE SOLVED: To provide a soldering device and a method of soldering, capable of soldering a tip of a former exposed from a cable core while the tip is set in a horizontal position when a connecting section of a superconducting cable is constructed.

SOLUTION: A soldering device 1 includes: a solder bath 30 for storing molten solder S; a mounting table 10 on which a tip of a former is horizontally mounted; and a jetting port 20 for jetting the molten solder S supplied from the solder bath 30 wherein the port is surrounded by sidewalls and an upper part of the port opens. The jetting port 20 has an inner wall 21 surrounding the tip of the former and an outer wall 22 disposed on an outer side relative to the inner wall 21, and is formed into a flat panel shape. An opening of the jetting port is formed in a position higher than the uppermost part of the tip of the former mounted on the mounting table 10. The jetting port 20 continues jetting the molten solder S so that the tip of the former is held in a state where the entire tip is immersed in the molten solder S overflowed from the jetting port.

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