| 摘要 |
PROBLEM TO BE SOLVED: To provide a mechanism for mounting a semiconductor chip on a chip mount board in a state in which curving of the semiconductor chip is corrected without mounting and pressing the semiconductor chip on and against the chip mount board in different processes and by different devices. SOLUTION: A device for fabricating a semiconductor device includes a chip transfer unit which has a collet 27 for sucking and holding the semiconductor chip and transfers the semiconductor chip held by the collet 27 to the chip mount board. The collet 27 includes a first collet member 28 having suction holes 30 and 31 for sucking the semiconductor chip, and a second collet member 29 provided outside the first collet member 28 independently of the first collet member 28 to move in a direction of a collet center axis, and having a chip press portion 34 for pressing the semiconductor chip. COPYRIGHT: (C)2010,JPO&INPIT |
