| 摘要 |
PROBLEM TO BE SOLVED: To provide a glow plug energization control device for actualizing efficient release of heat from a power part via an adhesive to a heat sink by accurately managing the thickness of the adhesive which adheres and fixes a circuit part of the glow plug energization control device to the heat sink. SOLUTION: A multi-chip module 30 supported by a housing 10 is adhered and fixed to the heat sink 11 with the adhesive A. For this purpose, a protruded portion 40 protruded downward from a bridge portion 10f of the housing 10 is provided. The protruded portion 40 abuts on a plane X of the heat sink 11. As a result, the thickness t1' of the adhesive A which exists between the multi-chip module 30 and the heat sink 11 is primarily determined by a distance D between the bottom face 30b of the multi-chip module 30 and the plane X of the heat sink 11 opposing each other. Thus, the thickness of the adhesive A is accurately managed and so the power part 32 can continuously develop desired performance. COPYRIGHT: (C)2010,JPO&INPIT
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