| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a miniaturized pressure sensor maintaining bonding strength between a pressure-sensitive element and a diaphragm. Ž<P>SOLUTION: The pressure sensor 1 includes a double tuning fork element 15 having a vibration chip part 13 and a pair of base parts 14 connected to both ends of the vibration chip part 13, and a diaphragm layer 20 having a pair of support parts 23 to which the pair of base parts 14 of the double tuning fork element 15 are bonded through bonding members 40. Each step part 25 is provided on a loading surface 24 of each support part 23, and each support part 23 and each base part 14 are mutually bonded between the loading surface 24 and one main surface 11, and bonded between a sidewall 26 of each step part 25 and a sidewall 18 of the base part 14 facing to the sidewall 26. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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