发明名称 INJECTION-MOLDING MOLD, TEMPERATURE REGULATING UNIT, AND INJECTION-MOLDING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an injection-molding mold, a temperature regulating unit and an injection-molding method by which a period of time required for the heating and cooling of the mold during the injection-molding cycle can be shortened, and the consumption energy can be saved. Ž<P>SOLUTION: This injection-molding mold includes this temperature regulating unit 10 which is installed in response to a molding defective place. The temperature regulating unit 10 includes: an electric heating heater 11 which is installed in parallel with the mold surface in a vicinity of mold the surface; and a cooling circuit 12 which is installed in parallel with the mold surface and the electric heating heater 11 at a location farther than the electric heating heater 11 to the mold surface. The electric heating heater 11 and the cooling circuit 12 constitute the injection-molding mold wherein the surface of the electric heating heater 11 and the surface of the cooling circuit 12 are formed in a manner to be alternately face the mold surface. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010162845(A) 申请公布日期 2010.07.29
申请号 JP20090009172 申请日期 2009.01.19
申请人 SONY CORP 发明人 HAYASHI HIROKI;KOBAYASHI SEIJIRO;KANEDA TAKASHI
分类号 B29C45/73;B29C45/78 主分类号 B29C45/73
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