发明名称 METHOD OF FORMING PATTERN STRUCTURE
摘要 PURPOSE: A method for forming a pattern structure is provided to form a protection layer which prevents damage to a thin film pattern in a liquid process by using an incline ion implantation process. CONSTITUTION: A thin film pattern(120) with a depression(122) is formed on a substrate(110). An ion is implanted into the thin film pattern and a protection layer(130) is formed on the thin film pattern. The lower width of the depression increases by selectively etching the lower side of the thin film pattern by using the protection film as a mask.
申请公布号 KR20100085743(A) 申请公布日期 2010.07.29
申请号 KR20090005193 申请日期 2009.01.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, IM SOO;LEE, KUN TACK
分类号 H01L21/31;H01L21/28 主分类号 H01L21/31
代理机构 代理人
主权项
地址