| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing-die bonding film excellent in a balance characteristic between a holding force for a semiconductor wafer in dicing and separability in pick-up. <P>SOLUTION: This dicing-die bonding film includes a dicing film having a pressure-sensitive adhesive layer on a base material, and a die bonding film provided on the dicing film, the pressure-sensitive adhesive layer contains a polymer prepared by addition-reacting an isocyanate compound having a radical-reactive carbon-carbon double bond within a range of 70 to 90 mol% with respect to a hydroxyl group containing monomer, with an acrylic polymer containing 10 to 40 mol% of hydroxyl group containing monomer, and a crosslinking agent which has two or more functional groups having reactivity with the hydroxyl group in a molecule, and of which the content is 2 to 20 pts.wt. with respect to 100 pts.wt. of polymer, and is cured under a prescribed condition with irradiation of an ultraviolet ray. The die bonding film is constituted to contain an epoxy resin, and is bonded to the pressure-sensitive adhesive layer after irradiated with the ultraviolet ray. <P>COPYRIGHT: (C)2010,JPO&INPIT |
