| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve problems wherein there is obstruction for narrowing a display device since a sealing substrate can not be bonded at a range because deposition particles are turned around a shadow mask when a transparent common electrode is deposited on a TFT substrate by using a sputtering method based on the shadow mask in a display device, and further, higher manufacturing costs are required because of use of the shadow mask and there are difficulties for precision machining due to positioning accuracy. Ž<P>SOLUTION: The transparent common electrode can be deposited on a whole TFT substrate without using the shadow mask. Then, the sealing substrate is bonded on the TFT substrate, and an excessive section of a common electrode film is removed with an etchant after cutting. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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