| 摘要 |
<p>The present invention relates to A semiconductive polymer composition comprising (a) from 30 to 90 wt% of a polymer component, (b) from 10 to 60 wt% of carbon black and (c) from 0 to 8 wt% additives, based on the total semiconductive polymer composition, and wherein the composition comprises, when measured in accordance with the Surface Smoothness Analysis (SSA) method using a tape sample consisting of said semiconductive polymer composition as defined under "Determination Methods", less than 23 particles per m2 having a width of larger than 150 Î1/4m at the half height of said particle protruding from the surface of the tape sample, less than 10 particles per m<sup>2</sup> having a width of larger than 200 Î1/4m at the half height of said particle protruding from the surface of the tape sample, and preferably, about 0 particles per m<sup>2</sup> having a width of larger than 500 Î1/4m at the half height of said particle protruding from the surface of the tape sample, to a process for preparing the semiconductive polymer composition, its use and cables comprising the semiconductive polymer composition.</p> |
