| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device which has stable electric properties and excellent high-frequency properties even if it is reduced in size and thickness. <P>SOLUTION: The semiconductor device includes: a die pad 106; a lead 102 for signals; a connecting lead 103 for grounding which is connected to the die pad 106; a semiconductor chip 201 having an electrode pad for grounding; a metal thin wire 202; and a sealing resin 203 which seals the die pad 106 and the semiconductor chip 201, exposes lower portions of the lead 102 for signals and the connecting lead 103 for grounding as external terminals to seal them. The resin sealed semiconductor device is electrically stabilized since the connecting lead 103 for grounding is connected to the electrode pad for grounding. Furthermore, interference between high-frequency signals passing through the lead 102 for signals is suppressed by the die pad 106 and the connecting lead for grounding. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
