发明名称 WAFER TRANSFER APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a low-cost wafer transfer apparatus 300 that does not require unnecessary space outside a chamber 100, can make a carry-in/out opening 101 for a wafer provided to the chamber 100 as small as possible, and can accurately transfer the wafer W. Ž<P>SOLUTION: The wafer transfer apparatus is provided with: an extending/contracting means 2 composed of an X link unit 21; a guide member 8 engaging rotary shafts 22 between link elements 21a constituting the X link unit 21 to support them slidably along an axis C of extension and contraction; a holding means 4 fitted to a tip portion of the extending/contracting means 2 to hold the mount plate 1 so that the mount plate can be extracted and is disabled to rotate; and a guide mechanism 63 which guides the mount plate 1 to a reception/passing position while correcting a slight position shift from the axis C of extension and contraction in the middle of movement from a wafer W exchange room to the reception/passing position by the extending/contracting means 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010165956(A) 申请公布日期 2010.07.29
申请号 JP20090008304 申请日期 2009.01.16
申请人 HORIBA LTD 发明人 AOYAMA JUNICHI;KAKINUMA SHIGERU;OHASHI SATOSHI
分类号 H01L21/677;B25J9/00;B65G49/07 主分类号 H01L21/677
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