| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film laminating device achieving downsizing of the device and high-speed processing. Ž<P>SOLUTION: The film laminating device 10 includes head units 31a and 31b movable along Y rails 33a and 33b of a head unit moving mechanism 30. In the film laminating device 10, a small piece film A1 is cut out from a roll film A fed by the film moving mechanism 20, and the small piece film A1 is conveyed by a head unit moving mechanism 30 to be stuck to a sheet electronic substrate B conveyed by a substrate moving mechanism 15. In each of the head units 31a and 31b, four dies 36 movable upward and downward individually are arranged, and each of the dies 36 includes a die cutting blade 37, a suction port 38, and a fixing heater 39. In each of the head units 31a and 31b, a state detection unit 29 for a substrate is arranged, while a state detection part 42 is arranged below the movement area of the head units 31a and 31b. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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