发明名称 WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To make the resistance of a conductor less than before in a limited conductor formation region on a wiring substrate having the conductor formed on its one surface by screen printing. SOLUTION: When the conductor 20 is varied in width within a range of the width of the conductor formation region in the screen printing, the conductor 20 has such relationship between the width and film thickness that the film thickness of the conductor 20 increases to a maximum as the width increases and then the film thickness decreases. With this relationship, a maximum width Ws of the conductor 20 falling within the range of the width of the conductor formation region is larger than a width Wp of the conductor 20, the width Wp becoming a maximum film thickness Tp, and the conductor 20 comprises an assembly of a plurality of parallel-connected wiring portions 21 having a width Wsp, wherein the width Wsp of the individual wiring portions 21 and the maximum width Ws satisfy Wsp×N<Ws (N: an integer of≥2) and the width Wsp of the individual wiring portions 21 is larger than a film thickness Ts at the maximum width Ws in the relationship between the width and film thickness of the conductor 20. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010165715(A) 申请公布日期 2010.07.29
申请号 JP20090004441 申请日期 2009.01.13
申请人 DENSO CORP;KYOCERA CORP 发明人 SAGAWA HARUHIDE;OTANI YUJI;UENOSONO RYUICHI;MITSUTAKE MASATAKA
分类号 H05K3/12;H05K1/02 主分类号 H05K3/12
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