发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 Problem to be Solved To provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving. Solution A photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20° C. of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20° C. of 5 Pa·s or more and 500 Pa·s or less.
申请公布号 US2010189941(A1) 申请公布日期 2010.07.29
申请号 US20070440155 申请日期 2007.09.04
申请人 FUNAKOSHI SHINJI;OKITA KOSHI;YAMADA HIROSHI;TOMEBA KEI 发明人 FUNAKOSHI SHINJI;OKITA KOSHI;YAMADA HIROSHI;TOMEBA KEI
分类号 G03F7/004;B32B1/08;B32B27/18;G03F7/20 主分类号 G03F7/004
代理机构 代理人
主权项
地址