发明名称 CONDUCTIVE SEAL RING ELECTROSTATIC CHUCK
摘要 <p>The present invention provides an improved electrostatic chuck for a substrate processing system. The electrostatic chuck comprising a main body having a top surface configured to support the substrate, a power supply to apply a voltage to the main body and a sealing ring disposed between the main body and the substrate wherein the sealing ring has a conductive layer.</p>
申请公布号 WO2010085466(A1) 申请公布日期 2010.07.29
申请号 WO2010US21466 申请日期 2010.01.20
申请人 PLASMA-THERM, LLC;REYNOLDS, GLYN 发明人 REYNOLDS, GLYN
分类号 H01L21/00;C23F1/00;H01L21/02;H01L21/68 主分类号 H01L21/00
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