SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve the connection reliability between semiconductor chips by preventing a void between the semiconductor chips. CONSTITUTION: A wiring pattern(7) is formed on a first main surface of a first semiconductor chip. A chip mounting area(15) is formed on the first main surface of the first semiconductor chip. A second semiconductor chip is mounted on the chip mounting area of the first semiconductor chip. Underfill materials are filled between the first semiconductor chip and the second semiconductor chip. A fillet is formed on the outer surface of the second semiconductor chip by the underfill materials. An introduction unit(18) is formed on the first semiconductor chip to guide the underfill materials between the first and second semiconductor chips.