发明名称 METHOD AND DEVICE FOR LASER SOLDERING
摘要 <p><P>PROBLEM TO BE SOLVED: To perform continuous soldering, by changing a condensed shape of a laser beam suitable for not only one-by-one intermittent soldering, but also spot soldering and flow soldering, and by continuously feeding a solder and applying a laser beam while scanning a workpiece. <P>SOLUTION: The following two condensed shapes of laser beams are changeable to each other: a condensed shape S of a laser beam L to a workpiece 3 formed through a first optical system 6; and a condensed shape S of a laser beam L to a workpiece 3 formed when a second optical system 10 is inserted. By melting a thread solder, which is fed from a thread solder feeding means 2, in the two different condensed shapes S, spot soldering and flow soldering are made switchable to each other in a single device. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010162583(A) 申请公布日期 2010.07.29
申请号 JP20090007640 申请日期 2009.01.16
申请人 PANASONIC CORP 发明人 MORI MASAHIRO;NAKAI IZURU;NISHIKAWA YUKIO
分类号 B23K1/005;B23K26/04;B23K26/073;B23K101/42;H05K3/34 主分类号 B23K1/005
代理机构 代理人
主权项
地址