| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of bonding which accurately bonds a reinforcing plate provided with a window to a wiring substrate at a low cost and is adaptable to low-cost and high-mix low-volume production. SOLUTION: The method for manufacturing the wiring substrate by which the wiring substrate and the reinforcing plate provided with the window are bonded to each other through film glue includes: a process for bonding the reinforcing plate provided with the window and the film glue to each other by using a positioning jig and heating them for temporarily fitting them; a process for stacking the wiring substrate which is supplied in the form of a sheet of multiple arrangement or individual pieces and a reinforcing plate positioning guide frame by using positioning pins, putting the reinforcing plate with the glue into the guide frame and heating them for temporarily fitting them; and a process for performing main pressure bonding in the temporarily fitted state by a sheet laminator. COPYRIGHT: (C)2010,JPO&INPIT |
