| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a substrate structure which can be excellently patterned by suppressing unevenness in resist film thickness nearby a substrate peripheral edge; a method of forming a coating film using the substrate structure; and a method of manufacturing a panel substrate. Ž<P>SOLUTION: A rectangular substrate 10 having a uniform plate thickness has, in its peripheral edge region 10a, an inclined surface 11 where an upper surface of the substrate 10 is inclined in a lower-surface direction of the substrate toward an end surface 10c of the substrate 10. When a resist film is formed on the upper surface of the substrate 10 by using a spin coating method etc., the resist film falls toward the end surface 10c of the substrate 10 since the inclined surface 11 is provided in the peripheral edge region 10a of the substrate 10, so that swelling 20a of a surface of the resist film 20 is suppressed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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