| 摘要 |
Methods and apparatus for protecting a substrate support in a semiconductor process chamber are provided herein. In some embodiments, an apparatus for protecting a substrate support in a semiconductor process chamber includes a semiconductor substrate and a coating comprising yttrium disposed on an upper surface of the semiconductor substrate. The semiconductor substrate is configured to be removably placed on the substrate support. In some embodiments, the semiconductor substrate comprises silicon. In some embodiments, the coating comprises yttrium and oxygen. In some embodiments, the protective apparatus may be disposed atop a substrate support within a semiconductor process chamber. In some embodiments, the protective apparatus may protect the surface of the substrate support from damage during one or more chamber processes, such as marathon testing or chamber cleaning. |
