| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board with built-in electronic components of high reliability in mechanical strength and humidity resistance, in which a wiring pattern is formed on the entire surface of a multilayer substrate to improve the integration. <P>SOLUTION: The board has a first wiring pattern containing an electrode pad, an electronic component connected to the electrode pad, and a first insulating board arranged in lamination on the first wiring pattern so that the height direction of the electronic component is penetrated. The board has a core board, which has first and second surfaces equipped with the wiring pattern, an electrically conductive bump on the wiring pattern of the first surface, and an opening into which the height direction of the electronic component can rush, and is arranged in lamination on the first insulating board, so that the height direction of the electronic component rushes into the opening, and the electrically conductive bump penetrates the first insulating board to establish electrical conduction to the first wiring pattern. The board also has a second insulating board arranged in lamination on the second surface of the core board, and a second wiring pattern arranged in lamination on the second insulating board. Resin of the first insulating board exudes in the clearance with the electronic components in the opening of the core board. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
