| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can be easily manufactured and in which the chip area can be reduced. SOLUTION: A semiconductor chip 10 has the top face, the bottom face, and the side face connecting the top and bottom faces. On the top face of the semiconductor chip 10, an electronic circuit 16 is formed. On the bottom face of the semiconductor chip 10, bottom electrodes 18a and 18b are formed. At the corners of the semiconductor chip 10, side-face interconnections 20a and 20b are formed on the side face. The side-face interconnections 20a and 20b connect the electronic circuit 16 and the bottom electrodes 18a and 18b. COPYRIGHT: (C)2010,JPO&INPIT |
