发明名称 |
SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of obtaining surely a characteristic to be inherently obtained by adopting SiC as a raw material, and to provide a manufacturing method thereof. SOLUTION: An JFET 1 has a wafer 10 with at least an upper face 14A formed with silicon carbide, and a gate contact electrode 21 formed on the upper face 14A. The wafer 10 includes the first p-type region 16 that is an ion implantation region formed to include the upper face 14A. The first p-type region 16 includes a base region 16A arranged to include the upper face 14A, and a projected region 16B. The width w<SB>1</SB>in a direction along the upper face 14A is wider than the width w<SB>2</SB>of the projected region 16B, in the base region 16A. The gate contact electrode 21 is arranged in contact with the first p-type region 16, to overlap the whole thereof with the first p-type region 16 in top view. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010166024(A) |
申请公布日期 |
2010.07.29 |
申请号 |
JP20090244596 |
申请日期 |
2009.10.23 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
FUJIKAWA KAZUHIRO;TAMASO HIDETO;HARADA MAKOTO;NAMIKAWA YASUO |
分类号 |
H01L21/337;H01L21/265;H01L21/338;H01L29/47;H01L29/808;H01L29/812;H01L29/872 |
主分类号 |
H01L21/337 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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